High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
The F209 fine-pitch SMT equipment is compact (4' in length) and features the new Flying Vision & Nozzle Change system that dramatically reduces time loss do to excessive head movement. Flying Nozzle Change (High-Precision Mounting) allows zero de-ra
The GEM Topaz-X features a high precision single placement beam carrying 4 Flying Nozzle Change heads (each equipped with 3 nozzles) and 4 standard heads with exchangeable nozzles. The placement beam moves in X/Y and Z direction, while the board and
New Equipment | Board Handling - Conveyors
Board train conveyors for higher throughput Increases overall throughput Automatic grouping of several PCBs Improves board transfer times Reduced number of nozzle changes Board train - for increasing throughput Board train is a
0.15mm diameter). Adhesives Highest precision, even for delicate conductive adhesives with relatively large particles. Trouble free precision processing of abrasive media. Dispenser head heating prevents ‘stringing’. Potting Compou
The XP-243E provides accurate placement of small parts to larger odd-form components in a compact footprint. On-the-fly vision inspection and optical correction ensure the most accurate placements. Fuji's new dual vacuum (V2) nozzle holder performs
New Equipment | Rework & Repair Equipment
The FR-810 Hot Air Rework Station sets a new bar for convective rework. The new, compact and lightweight design (only 2.9 lb.) features a quiet, self-contained turbine air supply, capable of delivering approximately 100 L/min (free flowing). The new
The XP-143E provides high-speed placement of small and odd-form parts, ranging from 0402 to 20 x 20 mm, in a small footprint. The machine's front and rear supply units make the most out of your floor space by supplying up to 100 part types. Fuji's
Mechatronika's M50 Pick and Place System is a versatile automatic machine for placing SMD components from 0402 to 35 x 35 mm. Matured, high quality rigid construction, ease to program and excellent price to performance ratio make M50 perfectly suit
New Equipment | Wave Soldering
High temperature, lead-free Solder Fountain with blow-thru air nozzle, used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards. Microprocessor based digital controller that regulates solder temperature
