Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Count On Tools specializes in custom engineered nozzles for all types of LEDs (Cree, Luxeon, Phillips, NIchia, Osram, etc). Recent growth in LED technology and solid state lighting has provided the electronics manufacturing industry with viable sol
The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
Standard or Lead Free models available Solder/desolder capabilities PCB Board carrier Hot AIr Blow Through Gun Laser alignment Misc nozzle sizes
Model:FUJI IP – 3 5000 w/MTU-4R Date of manufacturing: June, 1995 Hours Run:: 30,884 Hours SPECIAL REMARKS:: With right side MTU installed, With Vision Monitor, Reject Part conveyor installed. Machine Software Version: V2.52 Machine Vision Sof
New Equipment | Selective Soldering
A new entry point in cost-effective, easy-to-operate, automatic batch selective soldering. ESS310 and ESS500 Selective Soldering Machines provide easy to operate, robust systems for batch processing of mixed technology boards that require selective
New Equipment | Wave Soldering
High temperature, lead-free Solder Fountain with blow-thru air nozzle, used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards. Microprocessor based digital controller that regulates solder temperature
The high-performance device for industrial use. Easily integrated thanks to small size and low weight. Also easy to use. Various nozzle geometries provide flexibility in use.
