New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
New Equipment | Test Equipment
Hanwha SM482 Plus SMT Assembly Line Hanwha SM482 Plus SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed:30000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young SPI, Automatic Pick and place mach
New Equipment | Test Equipment
KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t
New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
Model name :HP-520SPI Benefit High speed printing realization (2.0Cpk @ ±25㎛) Fine Pitch(0.2mm) , CSP , 0402 Control of printing speed and pressure over 5 sections Various PCB Clamping options depend on PCB t
3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys
The most reliable 3D data and 100 % inspection Our innovative 3D laser triangulation sensor, the RSC profiles real shape of features and also provides highly robust 3D data against considerable variations of PCB color and finishing condition, solde
Technical Innovation The first 10 bit image processing in its industry by on-the-fly vibrationless scan (High speed & high precision image acquisition) 4 times higher height measurement resolution than the existing Moire technology (The best
The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate
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