New SMT Equipment: offset value for spi (Page 1 of 1)

Koh Young KY8080 3D SPI

Koh Young KY8080 3D SPI

New Equipment | Test Equipment

Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808

Qersa Technology Co.,ltd

Smart Tweezers ST-5S - A Simpler Way for Testing SMD Components

Smart Tweezers ST-5S - A Simpler Way for Testing SMD Components

New Equipment | Test Equipment

Smart Tweezers ST-5S are the newest model in the Smart Tweezers line of handheld LCR-meters. This model will be replacing the previous ST-5 model. Smart Tweezers are a fully automatic, handheld, digital LCR-meter designed specifically for evaluating

Siborg Systems Inc

SPI 50T - 3D Solder Paste Inspection System

SPI 50T - 3D Solder Paste Inspection System

New Equipment | Inspection

The most reliable 3D data and 100 % inspection Our innovative 3D laser triangulation sensor, the RSC profiles real shape of features and also provides highly robust 3D data against considerable variations of PCB color and finishing condition, solde

PARMI

SPI HS60 - 3D Solder Paste Inspection System

SPI HS60 - 3D Solder Paste Inspection System

New Equipment | Inspection

The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate

PARMI

SHS60 - 3D in-line SPI System

SHS60 - 3D in-line SPI System

New Equipment | Inspection

3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys

Hanwha Techwin CO., LTD.

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