New Equipment | Solder Materials
RX18 no clean flux core wire solder was developed to provide excellent soldering results with all alloys and surface finishes. Engineered for robotic soldering, RX18 promotes thermal transfer, fast wetting and rapid solder penetration into plated thr
The AIP is a new Windows NT based Image Processor that surpasses all current industry standards. New functionality includes: * Automatically detects solder balls and voids. * Automatically corrects xray image distortion using dual calibration met
The X-eye 6300 is a top of the line 3D CT AXI X-ray inspection tool. It provides high accuracy and reliablity while still achieving ultra-high resolution images. The tool is best used for void defect and solder inspection.
The VP 510 is impressive because of its ease-of-use and simplicity such as, an automatic process procedure, automatic process fluid recognition, continuously adjustable temperature gradient, energy-saving quick start function, as well as many other f
New Equipment | Solder Materials
FCT Solder has positioned itself as a leader in lead-free solder products. As a licensee of Nihon Superior’s patented technology, we manufacture and sell the leading lead-free alloy, SN100C. FCT Solder is the original licensee of Nihon Superior’s tec
 VCTA –Z5X.jpg)
The patented technology control system of Z axis AOI can inspect component side of PTH technology. Simpler debugging algorithm, make the programming easier and easy to learn. shift of two sides of board (components top and bottom), auto software or
ASSCON’s vacuum soldering process combines the average of the vapor-phase with the vaccum process. The vaccum module consists of the evacuation unit mounted in the process chamber where it is secured with quick-locks for fast and easy removal f
New Equipment | Solder Materials
AIM introduces M8 Solder Paste, a high reliability no clean paste for use with SAC305, REL22, REL61, and Sn/Pb alloys. M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly success
As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app
Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
