New Equipment | Solder Materials
Cobar XF3 Solder Paste Completes SN100C Solder Materials System; Superior Reflow, Printing Performance over SAC Alloys. XF3 is a lead-free solder paste, developed to accommodate extended reflow profiles without use of nitrogen. XF3 completes the
New Equipment | Education/Training
Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for
New Equipment | Solder Paste Stencils
Dry Film Solder Application SolderMask, Inc. continues to apply Dry Film Solder Mask (DFSM) on Printed Circuit Boards (PCB) since opening for business in 1985. SolderMask, Inc. works with all DFSM available in the United States. Some of the DFSM ma
New Equipment | Selective Soldering
Nitrogen is an essential part of the selective soldering process. Soldering without a nitrogen atmosphere leaves solder joints open to the possibility of oxidizing. Individual components will not maintain the long term reliability expected in the har
New Equipment | Solder Materials
Nitrogen is an essential part of the selective soldering process. Soldering without a nitrogen atmosphere leaves solder joints open to the possibility of oxidizing. Individual components will not maintain the long term reliability expected in the har
Inspection System for Die Casting, Automotive Components, Defense Components, Cultural Assets and Large Products Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cra
dataCon has designed and manufactured many of the current backplane technologies such as VME 64X, PCI, and VXI. We can provide substrate procurement (from one of our partner companies or the customer's approved supply base), press fit and solder asse
New Equipment | Solder Materials
High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing
Nitrogen is an essential part of the selective soldering process. Soldering without a nitrogen atmosphere leaves solder joints open to the possibility of oxidizing. Individual components will not maintain the long term reliability expected in the har
New Equipment | Selective Soldering
Nitrogen is an essential part of the selective soldering process. Soldering without a nitrogen atmosphere leaves solder joints open to the possibility of oxidizing. Individual components will not maintain the long-term reliability expected in the har
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