New Equipment | Solder Materials
KappZapp3.5R Rosin-cored Solder is a convenient solder for most Copper, Brass and Stainless Steel plumbing and sheet applications. The center of the solder contains a Rosin flux. When the solder is heated, the flux is released and removes the oxide c
New Equipment | Solder Materials
KappZapp7R Rosin-cored Solder has rapidly become the audio industry standard for electrical / electronic Copper applications. The 7% Silver solder creates extremely clean conductive joints with high strength, ductility and corrosion resistance. The c
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New Equipment | Education/Training
The Atmospheric Pressure Plasma (AP Plasma) designed by professional engineers in an eco-friendly environment to completely remove any kind of organic pollutants. Application Academic and Industrial Research Laboratory Photoelectric eleme
New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
The IceBlast KG20S Battery is suitable for companies that have a limited number of short cleaning tasks.It is supplied complete with an ergonomic blasting gun and 5 m hose. The machine is unique due to its size and operation principles. It is electri
PLASMATREAT: Openair Plasma Process, Eliminating all Organic and Silicon-Based Contaminants Effectively Removes Electrostatically Attached Dust Applicable to Flat Surfaces as well as Complex 3D Shapes Atmospheric Plasma Process Reduces O
New Equipment | Solder Materials
A variety of printed circuit boards require protection of selected board areas during the Surface Finish or Assembly Process. A wide range of PEELABLE SOLDER MASKS, the SD 295X Series including the popular SD 2954 and SD 2955 provide such protection
SUSS MicroTec's newest product offering is a 300 mm lithography cluster which consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. LithoPack300 (LP300) is specifically designed for wafer bumping and wafer level packaging
New Equipment | Board Handling - Storage
Eureka XDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs http://www.eurekadrytech.com/fast-super-dryer/xdc-2001 Anti-static Glass, Anti-static Paint on Body and Shelves, Anti-static Caster / Stands, 1 M ω Ground Wire Capacity: 1314 L
