New SMT Equipment: osp oxidation (Page 1 of 1)

LOCTITE HF 212 Halogen-Free Solder Paste

LOCTITE HF 212 Halogen-Free Solder Paste

New Equipment | Solder Materials

8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr

Henkel Electronic Materials

  1  

osp oxidation searches for Companies, Equipment, Machines, Suppliers & Information

High Throughput Reflow Oven

Training online, at your facility, or at one of our worldwide training centers"
2024 Eptac IPC Certification Training Schedule

High Resolution Fast Speed Industrial Cameras.
SMTAI 2024 - SMTA International

Reflow Soldering 101 Training Course
Assembly Automation Technology

Training online, at your facility, or at one of our worldwide training centers"