Ersa HOTFLOW 4/14 Reflow Oven Working width: 45-560 mmProcess length: 4,400 mmHeated length: 2,665 mmCooling length: 1,735 mmWeight appr. 2,000 kgdimension: 5,030x1,410x1,350 mm Ersa HOTFLOW 4/14 Reflow Oven Ersa HOTFLOW 4/14 Reflow Oven Refl
Ersa HOTFLOW 4/8 Reflow Oven Working width: 45-560 mm Process Length: 3,260 mm Length Heated: 1,525 mm Length Cooled: 1,735 mm Weight app. 1,100 kg Dimension: 3,905x1,410x1,350 mm Ersa HOTFLOW 4/8 Reflow Oven Ersa HOTFLOW 4/8 Reflow Oven High
Ersa HOTFLOW 4/20 Reflow Oven Working width: 45-560 mm Process length: 5,920 mm Heated length: 3,805 mm Cooling length: 2,115 mm Weight appr. 2,600 kg Dimension: 6,600x1,410x1,350 mm Ersa HOTFLOW 4/20 Reflow Oven Ersa HOTFLOW 4/20 Reflow Oven
New Equipment | Cable & Wire Harness Equipment
Polytertafluoroethylene or Teflon PTFE is the first and most common of the Fluoropolymer products. Spaghetti Tubing or small diameter PTFE Tubing manufactured to AWG (American Wire Gauge) sizes has the widest range of applications thanks to its high
The YXLON FF35 CT computed tomography system is designed to achieve extremely precise inspection results for a wide range of applications. Available in a single or dual tube configuration, it is perfect for very small to medium size parts inspection
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
Silver Filled, Electrically Conductive Ink for Screen Printing AG-800 is a unique, electrically conductive silver filled ink designed for high-speed screen printing in flex circuit, membrane switch, and other additive circuit applications. AG-800 i
Molex's membrane switches provide durable, lightweight and low-profile options for integrating user interfaces and electronic components into a variety of applications including medical, industrial and commercial products. Molex standard membrane s
For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and
The YXLON FF20 CT computed tomography system is designed to achieve the best 3D inspection results at very high resolution. Whether for R&D, defect analysis, process monitoring, or CT metrology, the FF20 CT is ideally suited for inspection of a varie
