New Equipment | Board Handling - Pallets,Carriers,Fixtures
The award winning KIC profilers provide accurate and quick profiling, as well as optimum oven set up. Facilitates Reflow Profiling Works on Edge Conveyors with and without Center Board Support Profile Low Clearance Ovens Accomodates Extra Wide
Painless Profiling for Perfect Oven Recipes When utilizing the AutoM.O.L.E.®Xpert3 System, you are entering a new phase in the thermal management of your automated soldering operations. The new AutoM.O.L.E.®Xpert3 System automatically guides you thr
Built around ECD's award winning V-M.O.L.E.® Thermal Profiler, the OvenCHECKER™ system comes complete with the profiler, thermal barrier, pallet and M.O.L.E.® MAP software, making it a complete solution for reflow oven verification. OvenCHECKER™ gr
Classic PCB Profiling tools are used to create a repeatable thermal process that meets the specifications required by the solder paste and or component manufacturers. Only by profiling do you have any idea of what the actual temperatures are on the c
The only portable reflow oven optimizers with statistical process control (SPC). Regardless of the recipe and what your reflow oven's controls indicate, what your PCB actually experiences at board-level as it goes through the oven can be SIGNIFICANT
SMT-assembly products: reflow ovens, with combined convection, radiation and passive blackmirror techniques, equipped with profile builder for temperature profiles suitable for all assembly needs: multi-layer PCBs, BGAs leadfree solder pastes, high c
Reflow oven with five (5) top and five (5) bottom vertical heating zones, the ERO-500 is an economic solution for low to medium volume production runs. Utilizing plenum convection heating technology, the ERO-500 provides uniform temperature profilin
The Profiling Machine for your Profile Machine The ProBot automatically verifies whether each PCB is processed to specification in the reflow oven. The suspect PCBs then can be sent off to batch X-ray. Because the typical batch X-ray machine only in
Reflow cycle - runs the oven through the pre-defined temperature profile.> Bake cycle - used to drive the moisture from moisture-sensitive components.>
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
