New SMT Equipment: pad adhesion test (Page 5 of 74)

TMT-TC-2 Tip Tinner

TMT-TC-2 Tip Tinner

New Equipment | Rework & Repair Equipment

The TMT-TC-2 Tip Tinners is a compressed tablet of pure tin and ammonia phosphate formulation in a metal container with lid. It has a self adhesive pad on the underside to allow it to be affixed on, or near the work station. Removes tip oxidation

Thermaltronics USA, Inc.

SMT 256EP Solder Joint Encapsulant Paste

SMT 256EP Solder Joint Encapsulant Paste

New Equipment | Materials

SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and

YINCAE Advanced Materials, LLC.

ScanPLACE - Offline Programming, Measurement & Inspection

ScanPLACE - Offline Programming, Measurement & Inspection

New Equipment | Inspection

ScanPLACE provides a sophisticated and user-friendly alternative to complex CAM software packages and inaccurate, time consuming manual inspection and programming methods that cost assembly houses productivity, time and money. Programming Using a

ScanCAD International, Inc.

Cir-Kit Circuitry Repair Kit, Master Version, Non-ThermoBond

Cir-Kit Circuitry Repair Kit, Master Version, Non-ThermoBond

New Equipment | Rework & Repair Equipment

A Simple, Low Cost Solution to Damaged Circuitry PACE Cir-Kit Circuitry Repair Kits are a simple, low cost solution to damaged, lifted or missing circuitry on pc boards, allowing fast repair and modification per IPC 7721. Non-ThermoBond Cir-Kits are

PACE Worldwide

Lite  Fast A-1115-M

Lite Fast A-1115-M

New Equipment |  

Lite Fast A-1115-M is a clear UV coating with excellent adhesion to polyester, polycarbonate, polyurethane and many other plastics and cures within seconds. There are two particular functions where this UV adhesive is most frequently used, as a re

MLT/Micro-Lite Technology

BGA Rework Stencils

BGA Rework Stencils

New Equipment | Solder Paste Stencils

BGA Rework Stencils are now available direct to you and may be a major product improvement over what you are may be using now. FCT Assembly BGA Rework Stencils are designed to make your rework faster and cleaner. The materials used, design and precis

FCT ASSEMBLY, INC.

MARCH StratoSPHERE Plasma Treatment System

MARCH StratoSPHERE Plasma Treatment System

New Equipment | Surface Finish

Designed for wafer processing, Nordson MARCH's SPHERE™ series plasma systems, the StratoSPHERE offers superior plasma treatment for high-throughput advanced semiconductor packaging applications.  The StratoSPHERE plasma system is ideal for wafer pro

MARCH Products | Nordson Electronics Solutions

SIPAD Solid Solder Deposit (SSD)

SIPAD Solid Solder Deposit (SSD)

New Equipment | Other

SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a

SIPAD Systems Inc.

Bob Willis Electronics Assembly Video Library

Bob Willis Electronics Assembly Video Library

New Equipment | Education/Training

Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for

ASKbobwillis.com

Polyimide Film Stiffener,Complex polyimide Film,Polyimide (PI) Laminate,Polyimide (PI) Stiffener,Polyimide Flexible Laminate

Polyimide Film Stiffener,Complex polyimide Film,Polyimide (PI) Laminate,Polyimide (PI) Stiffener,Polyimide Flexible Laminate

New Equipment | Printing

Polyimide Film Stiffener ( Brown/Black) Halogen free Polyimide film stiffener is made of high heat resistant and high adhesive adhesive coating on PI film substrate,and the thickness is from 1mil to 10mil. The excellent properties of heat bonded to e

Yancheng Tiandi Insulation Co.,Ltd


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