New SMT Equipment: pad exposure (Page 1 of 1)

UV Exposure

UV Exposure

New Equipment |  

UV Exposure systems for high definition imaging on presensitised boards. Range from foam pad to vacuum securing of board with analog timers to double sided units with sliding frame and digital control.

CIF

Lite Fast I-2000

Lite Fast I-2000

New Equipment |  

The I-2000 Series of UV printing inks were designed for heat sensitive substrates in a wide spectrum of colors. Resistant to solvents, acids and bases, these UV inks will pass Military Specifications 893 and 775. Lite Fast I-2000 adheres to a wide

MLT/Micro-Lite Technology

AQUANOX® A4708 - pH Neutral Electronic Assembly Cleaning Chemistry

AQUANOX® A4708 - pH Neutral Electronic Assembly Cleaning Chemistry

New Equipment | Cleaning Agents

AQUANOX® A4708 is a neutral range pH chemistry designed to rapidly clean under densely populated low-gap PWB assemblies. AQUANOX® A4708 is effective on all flux types including no-clean and water soluble residues. AQUANOX® A4708 is specifically form

KYZEN Corporation

Prototype Assembly

Prototype Assembly

New Equipment | Assembly Services

TMS can offer a fast and cost effective PCB prototyping service by producing the track photo positives and carrying out the PCB board exposure and etching processes in-house. We have produced a custom electronic design through to a working PCB p

Team Manufacturing Services (TMS)

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

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