Product Desciption: Stencil clean roll for use in Stencil printers automatic 'under stencil cleaner' is made of the lint free, non woven, fabric. It has a high level of absorbancy and at the same time an open structure to allow for efficient vacuum w
New Equipment | Cleaning Equipment
Industrial HEPA Filters We manufacture and supply a wide range of Industrial HEPA Filters which has high filtration efficiency. These are manufactured by hemmed edges of aluminum separators in order to provide rigidity & uniform air flow. We do qual
New Equipment | Cleaning Equipment
The patented and award winning FLOOD BOX provides the absolute best cleaning results while also reducing chemisty usage and water loss. This is the perfect machine for low stand off components, highly dense boards, or to remove particularly stubborn
New Equipment | Cleaning Equipment
DEK SMT High Performance Cleaning Rolls are engineered to boost productivity and yield, reduce the risk of defects and minimise rework. An ideal choice for a superior clean of the stencil underside. To maximise pre-placement yield, it is imperative
Advanced Solder Paste Printer with 2D SPI On-Board. Auto screen printers with Advanced Vision System for all PCB types. Standard Features Include: 2D Solder Paste Inspection 3 Stage Automatic Conveyor Under Stencil Cleaning Ful
Advanced Dual Lane Solder Paste Printer with 2D SPI On-Board. Dual lane screen printers with Advanced Vision System for all PCB types. Standard Features Include: 2D Solder Paste 3 Stage Automatic Under Stencil Cleaning Full Proce
Advanced LED Solder Paste Printer with 2D SPI On-Board LED screen printer with Advanced Vision System for all PCB types Standard Features Include: 2D Solder Paste 3 Stage Automatic Under Stencil Cleaning Full Process Control
MODEL NAME:HP-350M ;HP-520S ; HP-680S ; HP-850S ; HP-1000S Benefit High speed printing realization (2.0Cpk @ ±25㎛) Fine Pitch(0.2mm) , CSP , 0402 Control of printing speed and pressure over 5 sections Various P
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
New Equipment | Solder Paste Stencils
DESEN Navigator SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±20μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum Print Area 6
| 1 |
