The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate
The most reliable 3D data and 100 % inspection Our innovative 3D laser triangulation sensor, the RSC profiles real shape of features and also provides highly robust 3D data against considerable variations of PCB color and finishing condition, solde
3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys
Compact Pemium Modular Printer Printing accuracy of +/- 20μm is achieved. All operations can be performed from the front panel, improving operability and maintenance. The automatic backup pin setup function significantly reduces setup ti
The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy. The optimal solution for monitoring and analysis of solder paste printing process. Measures Height, V
Do you have issues with the height of your paste deposit when printing close to your clamp foils? Let SigmaPrint take you to the EDGE of your printing boundaries! The CustomFoil � (PAT APP FOR) board clamp replacement system from SigmaPrint Technolog
High Performance Print SPI Born By Samsung's Advanced SMT Technology. Provides high print quality of 6 sigma level. Alignment Accuracy : ±12.5μm@6σ Print Cycle Time : 5seconds (Excluding printing time) Applicable PCB (LxW) : 330mm x 250mm Sten
Description This device is designed to measure the shapes of 3-dimensional surfaces of objects that measure from dozen microns to a few millimeters, and is commonly used for measuring solder paste samples spread over PCBs automatically and 3-dimens
9 SMT Assembly Lines Total placement capability 150,000 components/hr Fine pitch placement up to 12mil Component Ranges: 0201 to BGA and uBGA up to 55mm square 40 microns placement accuracy with 4 sigma capability RoHS Compliant Lines with N2 envi
