New SMT Equipment: parmi spi 50t (Page 1 of 1)

SPI 50T - 3D Solder Paste Inspection System

SPI 50T - 3D Solder Paste Inspection System

New Equipment | Inspection

The most reliable 3D data and 100 % inspection Our innovative 3D laser triangulation sensor, the RSC profiles real shape of features and also provides highly robust 3D data against considerable variations of PCB color and finishing condition, solde

PARMI

SPI HS60 - 3D Solder Paste Inspection System

SPI HS60 - 3D Solder Paste Inspection System

New Equipment | Inspection

The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate

PARMI

SPI 2500 3D Solder Paste Inspection System

SPI 2500 3D Solder Paste Inspection System

New Equipment | Inspection

The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy. The optimal solution for monitoring and analysis of solder paste printing process. Measures Height, V

PARMI

SHS60 - 3D in-line SPI System

SHS60 - 3D in-line SPI System

New Equipment | Inspection

3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys

Hanwha Techwin CO., LTD.

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