New Equipment | Education/Training
This is a combination lectured and hands-on course covering the information in the IPC J-STD-001 document. The J-STD-001, “Requirements for Soldered Electrical & Electronic Assemblies”, describes materials, method and acceptance
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces the new ezLOAD PCB Support System. With the recent increase of densely populated double-sided circuit boards, COT recognized the need for more affordable
New Equipment | Rework & Repair Equipment
Since 1982, Metcal has been a recognized worldwide leader in the electronics assembly marketplace. As part of OK International, Metcal’s industry-leading position addressing advanced technology in conduction soldering and rework/repair, has and will
BTU’s Pyramax™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. Pyramax™ systems provi
Tronixlink offers significant advantages to electronics OEMs, including reductions in capital risks, increased asset productivity, advantage of current technology, the ability to focus on core capabilities including design, R&D, product design, devel
Founded in 1985, Triton �lectronique Inc is a leading subcontractor in the field of electronic component assembly. With our production area occupying 42,000 square feet, our state of the art facilities can accommodate all of your projects, from the
Founded in 1985, Triton �lectronique Inc is a leading subcontractor in the field of electronic component assembly. With our production area occupying 42,000 square feet, our state of the art facilities can accommodate all of your projects, from the
FUTEK Model L2357 Series load cells, also known as S-Beam Jr., are the world�s most compact and lightest �S� or �Z�-beam load cells with the highest accuracy in linearity. Unique features include overload protection up to 1000% of the RO in both Tens
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
New Equipment | Education/Training
Get Ahead... Smart decisions and top-notch quality are critical to success — particularly in the highly competitive, ever-changing electronic interconnection industry. Training alone may help with your quality initiatives, but when key employees act
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