The YCP10 is developed as the successor to the YCP II, and offers high-performance printing in a compact body that is also cost effective. It has the versatility to handle large circuit boards, as well as a wide variety of stencil sizes despite its c
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a
New Equipment | Test Equipment
The Quickshot XRF handheld analyzer using x-ray tube technology (non-isotope based) features software that is simple to navigate and offers real-time results on its touchscreen PDA. When the user gets back to the laboratory, those results can easily
New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
Overview • higher performance than standard 68000 • delivered with fully automated test-bench • complete set of tests The D68000 soft core is binary-compatible with the industry standard 68000 32-bit microcoprocessor. It has a 16-bit data b
Custom libraries for automated aperture modifications Special cutting routines One-click data matrix code or barcode generation for stencil marking Fast Setup: Loose Foils and Framed Stencils The LPKF StencilLaser G 6080 automatically ad
New Equipment | Cable & Wire Harness Equipment
Equipped with reliable high precision technology, the CrimpCenter 36 S features a compact modular design offering space for up to 6 processing stations without compromising the high Schleuniger quality standards of the 6-Series. Various configuration
New Equipment | Cable & Wire Harness Equipment
Overview The CrimpCenter 64 is a fully automatic swivel arm crimping machine with up to 4 processing stations. At a maximum feed rate of 12 m/s (39.4 ft/s), the CrimpCenter 64 allows high-quality crimping, sealing, twisting and tinning of wires from
New Equipment | Assembly Services
Configurable T-style robot up to 1.5 m x 0.5 m x 0.3 m travel Velocities up to 1.4 m/s provide high throughput Integrated Cable Management System (CMS) shortens your machine build 3-axis load up to 25 kg for demanding applications Cus
New Equipment | Rework & Repair Equipment
The AT-GDP Series BGA Rework Systems are semi-automatic machines featuring the latest vision and process control technologies. Lead-Free applications consisting of complex components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s are rework
