Dingji technology company is specialized in the filed of component level industrial electronics repair,CyberOptics laser repair:Juki laser unit(KE730/740/750/760/2010/2020/2030/2050/2060/FX-1/2070/2080),Yamaha laser,Samsung laser,Tenryu laser,Philips
Flexible, Scalable Solutions For Maximum Versatility. Advantis® sets a higher standard for midrange assembly solutions, offering unmatched performance and flexibility at a low entry price. Advantis delivers scalable capacity, easy-to-use operation,
These evaluation boards should be used to facilitate analysis of Z-Communications' PLLs (part numbers beginning with PCA, PSN, or PSA). The MINIEVAL/SMVEVAL/USSPEVAL boards all feature the same SMA connectorized input/output ports as shown in Figure
New Equipment | Cleaning Equipment
Industrial Plasma Cleaning System When plasma cleaning your product, whether it be small or large plastic parts, medical implants, wafers or electronic components, you will find that all are uniformly treated in the BT-1. Benefits to you are better
New Equipment | Test Equipment
Metal dome (also named snap dome, tacticle domes) is the most improtant part of the switches. The metal domes are mainly use in the membrane switches, printed circuit boards, flexible circuit boards. The raw material is the thickness from 0.05mm to 0
CR Technology / Photon Dynamics AOI and X-Ray Equipment Full Service 24 hour turn around on most jobs! AOI Service Group (AOISG) is located in Southern California consisting of former CR Technology / Photon Dynamics (CRT/PDI), The AOI Service Gro
The ideal solution for any market. Genesis features a powerful combination of speed and flexibility to blur the boundaries between high-speed and flexible fine pitch placement. Outstanding price performance combines with traditional Universal uptime
Fuzion® is Universal’s flagship platform, leveraging the latest generation of head and feeder technologies, and software tools for maximum performance. Fuzion solutions maximize utilization, Overall Equipment Effectiveness (OEE), and productivity whi
The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course mat
Akrometrix Studio is an advanced set of integrated software modules that work together to provide the most comprehensive set of surface characterization and analysis capabilities available. When used with the TherMoiré AXP surface measurement system,