When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
New Equipment | Solder Paste Stencils
Product material: stainless steel (internal) + steel plate baking paint Storage quantity: 36 cans of tin paste Product weight: 13kg Product size: 495 * 750 * 95mm Application: SMT workshop solder paste storage control, first in, first out
New Equipment | Solder Paste Mixers
Model: nstar-600 Origin: Shenzhen, China Installation mode: vertical Color classification: solder paste mixer machine + mixing knife Applicable material: solder paste
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New Equipment | Soldering Robots
Soldering Maching for Soldering Flex PCB to PCBA Boards,Dispenser Solder Paste to FPC then Soldering Feature: Applicable to different products, adjustable heating rate; Titanium alloy indenter ensures average temperature, fast heating rate and lo
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
Model CWDJ-300 CWDJ-400 CWDJ-500 Working Area/mm 300(X)*300(Y)*100(Z) 400(X)*400(Y)*100(Z) 500(X)*500(Y)*100(Z) Size/mm 490(L)*528(W)*679(H
