Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
New Equipment | Solder Materials
AIM’s J8 No Clean Jetting Solder Paste is specially formulated for use with jetting equipment providing consistent solder deposits as small as 200μm. J8 is fully compatible with all AIM no clean solder pastes for use in applications where combining j
Hand held pneumatic solder paste dispenser for depositing solder paste on a stencil prior to printing. Eliminates the use of messy paste jars and spatulas. Uses standard 700 gram cartridges. Ideal for use with a semi-automatic or manual stencil pr
New Equipment | Solder Paste Stencils
Stentech has the technical ability to manufacture step stencils in both single process and dual process. Today's complex PCBs with the various components require different solder paste volumes. Stentech has the technical expertise to optimize the ste
The Z-100 and Z-Check 3D offer low cost methods to instantly measure and verify good Solder Paste deposition, a critical feed-back loop for SMT stencil set-up. The z-100 is a low cost manual Solder Paste Measuring system Teh Z-Check 3D is a low c
Maximize Your Micro-Electronics Printing Results Transition's patented Universal Holder design gives you outstanding functionality, ergonomics and choices that enable you to achieve greater performance and profitability on your SMT line. Permalex E
New Equipment | Solder Paste Stencils
Laser cut stainless steel Adhesive Stencil for adhesive printing. Adhesive stencils are used to solder SMD components with a solder wave, whereas the components are fixed with an adhesive. The adhesive spots are print in one printing process by usin
New Equipment | Solder Paste Stencils
100µm we recommend a special squeegee blade which is adjusted to the cavity size. Benefits: Adjustable paste volumes in one printing process Simultaneous print process on all levels Different paste deposit heights on all levels Available with
