Stand alone Semi-Automatic Stencil Printers with optional Accu-Lign Series Vision Alignment featuring " Train on Paste " capability to make set up a snap. Also available Programmable Squeegees and Under Stencil Wiper Module. 4 Available Vision L
Benchtop semi-automatic Dual independent squeegees Available Universal Magnetic Tooling 4 Point frame compensation system Retractable squeegee head assembly Specifications: Opti-Print 1616PD
New Equipment | Solder Materials
WS159 water washable solder paste is designed to provide humidity tolerance and excellent wetting to meet the requirements for reliable solder joints in PCB Assemblies. WS159 offers high levels of repeatability and consistency even in a wide range of
New Equipment | Cleaning Agents
VOC, CFC & HCFC FREE, Non-Aggressive, Very Mild Odor, Non Flammable, Non Toxic Certified as a “Clean Air Solvent” by the South Coast Air Quality Management District (SCAQMD), (AQP) is more than 95% water based and all ingredients are 100% active.
New Equipment | Solder Paste Stencils
Tropical Stencil’s Laser Cut SMT Stencils are produced utilizing high speed lasers to produce the smoothest aperture wall possible. Far superior to chemically etched stencils, and with emerging new materials, stencils are produced using “fine grain”
New Equipment | Solder Paste Stencils
DEK’s Nano-ProTek technology is a permanent, hydrophobic nano-coating that, when applied to the bottom-side of the stencil foil and stencil aperture walls, minimizes solder paste’s ability to stick to the foil surface. Up to a 10X increase in the num
New Equipment | Cleaning Agents
Aqueous Cleaner for Flip Chips and Advanced Packaging AQUANOX® A4520 is an aqueous blend designed to remove re-flowed pastes, tacky, no clean and a majority of lead free residues while exceeding industry standards for worker and environmental sa
New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
i-TECH ASYMTEK - Fluid Dispensing & Conformal Coating BTU - Reflow & Cure Oven Technology COGISCAN - Material/Component Tracking CYBEROPTICS - 3D Print Inspection, AOI Inspection ECMG - Printed Circuit Board Technologies
i-TECH ASYMTEK - Fluid Dispensing & Conformal Coating BTU - Reflow & Cure Oven Technology COGISCAN - Material/Component Tracking CYBEROPTICS - 3D Print Inspection, AOI Inspection ECMG - Printed Circuit Board Technologies
