New Equipment | Solder Paste Stencils
Fine Line introduces our Slic™ laser cut stencil. The Slic™ material has been proven to outperform the industry standard stainless steel material. Slic™ has the mechanical and thermal properties of industry standard stainless steel, yet offers superi
High Value Stencil Screen Printing Solutions from JUKI. The GL printers utilize a patented mathematical calculating algorithm to ensure the machine’s high accuracy print alignment that easily achieves 01005 (0402 metric) printing. Vision and Opti
New Equipment | Solder Paste Stencils
Laser Fab, NiPlate™, NanoCoat™. NicAlloy-XT™ stencils are the premier laser-cut stencils in the industry. Beginning life as a laser-cut stencil, followed by a secondary process utilizing Photo Stencil’s own proprietary NiPlate™ technology, which fur
New Equipment | Cleaning Equipment
The Model 1550 Stencil & Pallet Cleaner is our most popular semi-automatic system. It is designed to clean stencils up to 29" x 29" (740 x 740 mm) and fully equipped with the following integrated options: Heated Wash Tank Filter Recirculator
The K3-II is designed to meet the printing demands of extra large board sizes with maximum board size supported 610mm x 610mm. Vision and Optics System The simultaneous up/down Optical Structure large resolution (1.3 megapixel) digital camera enhan
The PMAXII printers utilize a patented mathematical calculating algorithm to ensure the machine’s high accuracy print alignment that easily achieves 01005 (0402 metric) printing. Vision and Optics System The simultaneous up/down Optical Structure l
New Equipment | Solder Materials
8 hrs. @ 30–45% RH & 22–25°C ~6 hrs. @ 45–70% RH & 22–25°C Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using 99% isopropyl alcohol (IPA) works well. Storage and Handling Proce
New Equipment | Cleaning Equipment
clean wiper roll are used to remove residual solder paste from the bottom side of PC Board stencils. Using Stencil Wiping Rolls prevents smearing, bridging, and solder balls caused by normal printing of solder paste onto PC Boards. Specifications:
Used on SMT machinery i.e. DEK, MPM, EKRA, Panasonic etc., to clean residual solder paste
ScanINSPECT VPI is a fully integrated, stand-alone process control, measurement and inspection and programming workstation for use in process setup and new product introduction in the PCB or Hybrid Microcircuit assembly industries. ScanINSPECT VPI
