New SMT Equipment: paste transfer (Page 1 of 5)

Laser Solder Paste Scanning Tin Hot Bar Soldering Machine Visual Positioning System

Laser Solder Paste Scanning Tin Hot Bar Soldering Machine Visual Positioning System

New Equipment | Soldering Robots

Product Description CCD automatic scanning after the starting point after the puzzle solder paste, laser welding using the disposable whole mirror; solder supply system: the structure of 4 axis horizontal joint manipulator + platform; automatic disp

ChuangWei Electronic Equipment Manufactory Ltd.

Koh Young KY8030-3 3D Inline SPI

Koh Young KY8030-3 3D Inline SPI

New Equipment | Test Equipment

Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:

Qersa Technology Co.,ltd

Hanwha SM471 Plus SMT Assembly Line

Hanwha SM471 Plus SMT Assembly Line

New Equipment | Test Equipment

Hanwha SM471 Plus SMT Assembly Line Hanwha SM471 Plus SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed:78000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young SPI, Automatic Pick and place mach

Qersa Technology Co.,ltd

Hanwha DECAN S2 Assembly line

Hanwha DECAN S2 Assembly line

New Equipment | Other

Hanwha Decan S2 SMT Assembly line Decan S2 SMT Assembly Line Decan S2 SMT Assembly Line SMT PCB production Full Automatic Assembly line Speed:158000CPH Product description: Hanwha Decan S2 SMT Assembly line, Speed 158000CPH  INQUIRY Ha

Flason Electronic Co.,limited

DEK ProActiv - Process Technology for Unprecedented Paste Transfer Efficiency

DEK ProActiv - Process Technology for Unprecedented Paste Transfer Efficiency

New Equipment | Printing

ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can be p

ASM Assembly Systems (DEK)

Electroformed SMT Stencils

Electroformed SMT Stencils

New Equipment | Solder Paste Stencils

Stentech is at the forefront of the next generation of stencils, Electroformed Stencils, with more than ten years of research and development. Stentech has now been manufacturing quality Electroformed Stencils for over five years for our North Americ

Stentech

Henkel Loctite GC 10 - The Game Changer

Henkel Loctite GC 10 - The Game Changer

New Equipment | Solder Materials

16 hours), and abandon time (>8 hours) Improved paste transfer efficiency Printing: Suitable for high speed printing up to 125 mms-1 Improved reflow process window (high soak temperatures and time) with superior coalescence and wetting Very shiny

Blue Thunder Technologies, Inc.

NanoSlic Gold Stencil Coating

NanoSlic Gold Stencil Coating

New Equipment | Solder Paste Stencils

MET Stencil announces a new sprayed on baked on coating called NanoSlic Gold. We are currently offering a no charge sample to all of our new, and existing customers. Using advanced polymer chemistry, this coating has been developed to address the inc

MET Stencil

NanoWork® - Laser Cut Stencils With Anti-Adhesion Properties

NanoWork® - Laser Cut Stencils With Anti-Adhesion Properties

New Equipment | Solder Paste Stencils

Laser cut stainless steel stencil with nano coating from LaserJob. The patented NanoWork - stencil from LaserJob is based on a laser cut SMD stencil. Since 2007 LaserJob coates SMD - stencils and step stencils in an in-house process. The NanoWork co

LaserJob

Paste Flux Tacky Flux

Paste Flux Tacky Flux

New Equipment | Solder Materials

Paste flux is a combination of tackifier and fluxing agent specially formulated for touch-up soldering. BGA packages and flip chip applications. Paste flux may be applied by screen or stencil printing, pin-transfer and syringe dispensing. Four types

solderstoreonline.com

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