The Cogiscan RFID Screen Printer Retrofit Kit is a cost effective way to validate that the right solder paste, stencil and other tooling are in use. The kit is integrated into the screen printer and enables material tracking, traceability and control
New Equipment | Solder Materials
NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC
The new LineMaster DM incorporates SPI and AOI into one platform for “Dual Mode” performance. The solid AOI / SPI platform validates the overall variables associated with component placement and solder paste printing. Combining both inspection cap
The new LineMaster DM incorporates SPI and AOI into one platform for “Dual Mode” performance. The solid AOI / SPI platform validates the overall variables associated with component placement and solder paste printing. Combining both inspection cap
The MVP approach to 3D AOI utilizes the combination of both 2D and 3D AOI technologies bringing the advantages of high speed and superior defect coverage for complex defects. MVP’s advanced software tools are the key to taking advantage of each of th
Applying to all kinds of circuit boards with highly promoting the inline labeling production and decreasing the reject rate. High Efficiency Imported five-axis servo moving system; High speed conveyor designation; High-
High-Mix, Medium Volume Automated Optical Inspection The Supra E is the class-leading, cost effective solution for all PCB manufacturers with PCBs up to 20” x 20”. MVP’s Quad-Color technology provides the ability to use multiple angles of light t
The Ultra V is MVP’s fastest AOI system, designed for manufacturers with the need for the fastest beat rates. The Ultra V Series deploys the highest speed interfaces, computers and camera technologies to provide the fastest inspection times without
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
NPI and Low Volume Desktop Automated Optical Inspection with In-line Performance. MVP's GEM Compact AOI system is a revolutionary tabletop, lightweight inspection solution. MVP is now offering unsurpassed high performance and high resolution capabi
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