is a water-based cleaning medium utilizing our unique technology, designed to remove solder pastes and SMT adhesives from from PC boards, stencils, screens and mis-prints in heated and unheated spray-in-air and ultrasonic cleaning systems.
is a water-based cleaning medium, designed to quickly remove fluxes, solder pastes and SMT adhesives from PC boards, stencils, screens and mis-prints in heated and unheated spray-in-air and ultrasonic cleaning systems.
We offer PCB assembley from 12 SMT modern lines with strong effective Solder Paste AOI Japanese inspection machine. We can do high volume production .
Mechatronika's MD40 Liquid Dispensing System is a versatile automatic machine for dispensing solder paste, glue or virtually any viscous substances. MD40 combines mechanical accuracy with high quality pattern recognition system built into easy to u
New Equipment | Solder Materials
Cobar XF3 Solder Paste Completes SN100C Solder Materials System; Superior Reflow, Printing Performance over SAC Alloys. XF3 is a lead-free solder paste, developed to accommodate extended reflow profiles without use of nitrogen. XF3 completes the
New Equipment | Solder Paste Stencils
Stentech is at the forefront of the next generation of stencils, Electroformed Stencils, with more than ten years of research and development. Stentech has now been manufacturing quality Electroformed Stencils for over five years for our North Americ
Aerosol 1 gallon Pail 5 gallon Pail 55 gallon Drum Huge Cleaning Power on Fluxes and Pastes Double-Duty as Powerful Degreaser Low Aroma, No Residues Nonflammable Instant Drying
