New Equipment | Solder Materials
Kapp Golden Flux™ PASTE has been designed specifically for soldering Aluminum to Aluminum and Copper. Kapp Golden Flux™ PASTE stays where you put it. It is designed for use on Aluminum-to-Aluminum or Aluminum-to-Copper sheets and tabs where fluxing a
New Equipment | Solder Materials
Alpha® offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications. Our offering includes leading lead-free, no-clean, halogen-free solder
Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with
New Equipment | Solder Materials
Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,
The MK-2000 consists of two independent print chambers - two print heads, two print tables, and two stencils - within a single device. This set-up provides ultimate flexibility for today's challenges in electronic manufacturing. Possible applications
New Equipment | Solder Materials
FCT Solder has positioned itself as a leader in lead-free solder products. As a licensee of Nihon Superior’s patented technology, we manufacture and sell the leading lead-free alloy, SN100C. FCT Solder is the original licensee of Nihon Superior’s tec
New Equipment | Solder Materials
High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing
Fine Line Stencil's unique Slic Blade™ process uses electroformed nickel to form a hard, very smooth surface with extremely low surface energy (high lubricity). Solder paste readily sticks to most metal surfaces, even coated blades, due to metal's hi
New Equipment | Solder Materials
NC676 No Clean Solder Paste is a new generation halide-free, rosin-based chemistry designed to provide a previously unseen level of repeatability and consistency to the printing process. This paste offers an excellent open time, extended abandon time
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
