New Equipment | Education/Training
Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements. An example would be our combination type certificate t
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
New Equipment | Solder Materials
We offer a full line of Water Soluble Fluxes and No-Clean Flux for SMT, IC packaging and PCB Wave solder applications. We provide halide-containing and halide-free fluxes for Lead-Free solder alloys. Besides, our Lead-Free Liquid Fluxes have been a
New Equipment | Solder Materials
Indium Corporation is a developer, manufacturer, and global supplier of: specialty solders (including solder paste, preforms, spheres, columns, wire, tubing, ribbon, and foil), fluxes, electrically-conductive adhesives, inorganic compounds (including
Pure tungsten sheet, plate, tungsten alloy sheet, plate. Alloy Sheet(thickness) W1 0.5-8.0 CW1 0.5-8.0 W2 0.5-8.0 WAl1 0.5-8.0 WAl2 0.5-8.0 WAl3 0.5-8.0 WCe15 0.5-8.0 WTh7 0.5-8.0 WTh10 0.5-8.0 WTh15 0.5-8.0 Wl10 0.5-8.0 W-Ni-Fe 0.5-8.0
PC boards and kits for machine set-up and calibration, hand solder training, rework, practice, testing and more along with a drawing of each PCB. Practical has a PCB board or kit to meet your requirements. BGA Fine Pitch, Global Daisy-Chain or Vari
OMG offers the Microbond brand of printing and dispensing solder pastes. Available in a wide range of alloys and WS, RM and NC vehicle systems.
Tungsten and Tungsten Alloy Bars&Rods Alloy Bar W1 ����2.0 CW1 ��2.0-5.0 W2 ����2.0 WAl1 ��2.8-11.0 WAl2 ��2.8-11.0 WAl3 ��2.8-11.0 WCe15 ��1.0-10.0 WTh7 ��0.8-2.8 WTh10 ��2.8-10.0 WTh15 ��2.8-10.0 Wl10 ��2.8-10.0 W-Ni-Fe ����5.0 W-Ni-
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
New Equipment | Solder Materials
Kapp Alumite fluxless Aluminum soldering & brazing rod for the fabrication, maintenance and repair of cast Aluminum and Zinc alloys. Alumite™ has been used and endorsed by leading cast Aluminum, diecast and white metal manufacturers for over 60 years
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