Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
New Equipment | Soldering Robots
Model R50CD (Computer) Heating zones Upper 5/lower 5 Length of heating zone 1730mm PCB width Chain 300mm, mesh 350mm Conveyor chain width range 50-300mm PCB direction L→R or （R→L） Chain fixing Front fix(back fix is optional) Conveyor hei
0.6MPa Power: 500W Voltage: 220V/50HZ & 110V/60HZ Net Weight: 280kgs Gross Weight: 360kgs Machine Dimensions: 1288×1062×1291mm(Without Tri-color Packing Dimensions: 1420×1220×1665mm Videos: https://www.youtube.com/c/NeoDenTechnology Mai
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Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
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