New Equipment | Fabrication Services
XPCB Limited is one of the leading flexible PCB suppliers in China. We fabricate and assemble the most complex flexible circuit boards for harsh applications, including Oil&Gas, Medical, Security, and Aircraft & Satellite. Layer supported: 1-12 laye
Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width
Gold finger PCB/Impedance computer circuit board Layer:6 Thiness: 2.0mm Surface treatment: ENIG+Hard gold plated on gold finger Impdance control: Single-ended 50ohm, differential 90 ohm Application: Computer
FR-4 Material 2. 4 mm Thickness 3OZ base Cu 10 Layers Immersion Gold Surface Treatment Green Solder Mask
New Equipment | Assembly Services
Quick turn Prototype PCBs from 24 hour turnaround to high volume printed circuit board production from our domestic plant in USA and/or China facilities. Our Modern 38,000 sq. ft. manufacturing plant with multi-million dollar investment with latest e
Consisting of multiple laminates and differing dielectric constants, this multilayer (displayed right) is a mixed-dielectric printed circuit board which was manufactured for the Aerospace Industry. Multilayer Mixed Dielectric PCB Specifications:
Double-Sided & Multi-Layer PCB Material: - FR-4 / Hi-Temp FR-4 / FR-5 / G10 / BT / Polyimide - Very Thin PCB: 0.004" 2L ~ 0.030" 8L - Thick Copper: 1/4 oz. ~ 11 oz. Process: - PTH - Blind/Buried/Segmented Via - Sequential Lamination - MicroVia Capa
Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
Bicheng provides impedance controlled PCB's for R&D, high-tech, IT research companies and organizations, large or small. Technical parameters *Controlled dielectric *Controlled impedance *Design coupons *Test coupons *Po
New Equipment | Design Services
Layer:4 Material:FR-4 4/4/4/4oz Thickness:2.0 Minimum hole:0.35mm Minimum Tracc/Spacing:12mil/15mil Application:power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space:
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830