Painless Profiling for Perfect Oven Recipes When utilizing the AutoM.O.L.E.®Xpert3 System, you are entering a new phase in the thermal management of your automated soldering operations. The new AutoM.O.L.E.®Xpert3 System automatically guides you thr
TR360 is the simplest solution, the most compact-size and cost-efficient reflow oven, but it is functional over your expectation, fully like the large full-size reflow oven. Please see details below: 1). It is suitable for both leaded and lead-fr
Versatile reflow oven for medium volume soldering (leadfree or leaded solder). 400 mm process width. Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards. 5 zone reflow oven 400
Material: CEM-1 Layer: 1 Thickness: 0.8mm Surface treating: Pb free HAL Solder mask: Green Min. Line/Space: 0.2mm Min. Hole: 0.3mm Lead Time: Sample 3 days S. 5 m2, 10 days Profiling: Routing Copper: 1oz Electronical Test We are always
reflowsystems.com manufactures and distributes three series of ovens to offer a perfect fit in size and price for every production need: 1) CORA 450 and 250 are combining not only COnvection and RAdiation to guarantee stressfree soldering of BGAs eve
V3/V4/V5 vapor phase reflow oven Model: V3/V4/V5 Product Description Product introduction: The name V3/V4/V5 is called according Vacuum , means professional industrial Vacuum reflow oven . Why chose Vacuum reflow oven? Recently ,the main weld
M.O.L.E.® MAP is ECD's current software for setup, download, analysis, prediction and data storage that ships with the all new SuperM.O.L.E.® Gold 2 thermal profiler, the MEGAM.O.L.E.® 20, the V-M.O.L.E.®, the PTP® VP-8 and the SuperM.O.L.E.® Gold, E
The V-M.O.L.E.® is a full-featured compact thermal profiler that belies its sophistication in an easy-to-use 3-channel Mini-thermocouple configuration. Ideal for VERIFICATION of PCB profile performance, 3 channels give you Hot, Cold and Sensitive com
New Equipment | Rework & Repair Equipment
The new MiniOven-05 is a compact and versatile IR reflow oven suitable for a wide range of SMD components. This newest version provides enhanced process capability with updated firmware and increased control and temperature stability. The highly eff
New Equipment | Rework & Repair Equipment
Desktop Reflow Oven For Reballing and Prebumping of SMD Components The new MiniOven-04 is perfectly suitable for a wide range of applications, from small QFNs to very large BGAs. This is due to our extensive selection of stencils and masks for almos
