New SMT Equipment: pin hole ratio (Page 1 of 5)

Unisoft ProntoPLACE

Unisoft ProntoPLACE

New Equipment | Software

ProntoPLACE used by electronics manufacturers will quickly program your surface mount SMT and thru-hole assembly equipment. In minutes Unisoft ProntoPLACE software translates CAD or Gerber and Bill of Materials (BOM) files into real reference desig

UNISOFT Corporation

Unisoft ProntoGERBER CONNECTION - Gerber Translation Software

Unisoft ProntoGERBER CONNECTION - Gerber Translation Software

New Equipment | Software

If you have only Gerber data files to work with then ProntoGERBER-CONNECTION can help you!  ProntoGERBER-CONNECTION imports raw Gerber data and allows the user to add intelligent information to the shapes on the display and create process assembly

UNISOFT Corporation

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

New Equipment | Software

ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc.  ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat

UNISOFT Corporation

Custom Pin Fin BGA Heat Sinks

Custom Pin Fin BGA Heat Sinks

New Equipment | Other

BGA Heat Sink (High Aspect Ratio Ext.) High efficiency pin fin design provides low pressure drop characteristics Large surface area increases heat sink performance Fabricated from extruded aluminum, which minimizes thermal resistance fro

Advanced Thermal Solutions, Inc

Power PCB

Power PCB

New Equipment | Design Services

Layer:4 Material:FR-4 4/4/4/4oz Thickness:2.0 Minimum hole:0.35mm Minimum Tracc/Spacing:12mil/15mil Application:power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:  

Multycircuit Technology Limited

Printed Circuit Board

Printed Circuit Board

New Equipment | Printing

Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ M

Multycircuit Technology Limited

Rigid PCB

Rigid PCB

New Equipment | Materials

Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:   3mil/3mil Min

Multycircuit Technology Limited

Multilayer PCB

Multilayer PCB

New Equipment | Inspection

Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width

Multycircuit Technology Limited

SMT splice tool

SMT splice tool

New Equipment | Materials

Feature(SMT Splice Cutter): 1. Imported scissor. 2. Two rows of placement pin(P/N.: SMS-TL20). When cutting different kinds of carrier tape, big component (one component between two holes) will be put in first row of placement pin while small co

SHENZHEN KHJ TECHNOLOGY CO.,LTD

LPKF ProConduct® - Through-hole Conductivity System

LPKF ProConduct® - Through-hole Conductivity System

New Equipment | Through-Hole

In-House PCB Through-Hole Plating without Chemicals The LPKF ProConduct® introduces revolutionary technology to produce plated through-holes, which does not require a plating tank or potentially hazardous processing chemicals. This compact system is

LPKF Laser & Electronics

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