High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
FKN Systek K3000 - Singulate scored and skip scored panels up to 24" long ESD protective mat on back table Adjustable front and back support table Singulate panels with components up to 2.5" high Available in 18" blade (standard) or 24" blade (
New Equipment | Soldering Robots
FFC FPC to PCB Bonding Machine HSC WelidingMachine,CW-2A2P Working Picture: FFC FPC to PCB Bonding Machine HSC WelidingMachine,CW-2A2P Simple introduction: This device is designed for double - deck working mode of double welding he
New Equipment | Soldering Robots
CW-2A2P,Sample for China Hot Bar Pulse Heat Soldering Machine for FFC FPC PCB Hot Bar Soldering Method for Soldering Two Circuit Boards Together Introduction: This device is designed for double - deck working mode of double wel
New Equipment | Soldering Robots
Desktop Hot Bar Soldering for Fpc-Flexible Circuit Board Hotbar Welding with Dual Station,CW-2A2P Specificaitons: Subject Parameters Machine Size (L)850×(W)650×(H)1320mm Working Size Max 150x150m
New Equipment | Soldering Robots
HSC Hot Bar Soldering Machine with Smart Thermode,FPC Hotbar Bonder,FFC Hotbar Welding CW-2A2B: Fpc Pulse Heat Bonding-the Result of Flexible Circuit Board Hotbar Soldering Pulse Heat Hot-bar Soldering,CW-2A2B Spec
New Equipment | Soldering Robots
Electronic Bonding Equipment Soldering for FFC HSC FPC to PCB Features: 1. Customized based on the connector; 2. Double jig welding; 3. Double- desk working mode; 4. Can achieve ultra-fine pitch welding; 5. Applicable to welding the cable and
Methods in accordance with PRO-STD-001, SAE AS 5553, and SAE AS 6081. Process follows ISO/DIS 12931. Datest tools and training are used to detect packaging damage; ESD compliance violations; falsified or altered documentation; tampered part markin
The Boundary Scan Probe serves as a handheld tool for debugging of UUTs and JTAG/Boundary Scan devices. It basically is a virtual JTAG/Boundary Scan pin providing several advantages, e.g. static and dynamic logic pen functionality. Probe the test obj
New Equipment | Test Equipment - Bond Testers
Fully integrated solution for automated wafer testing (up to 300 mm). The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages av
