New SMT Equipment: placement head system (Page 1 of 53)

Unisoft ProntoPLACE

Unisoft ProntoPLACE

New Equipment | Software

ProntoPLACE used by electronics manufacturers will quickly program your surface mount SMT and thru-hole assembly equipment. In minutes Unisoft ProntoPLACE software translates CAD or Gerber and Bill of Materials (BOM) files into real reference desig

UNISOFT Corporation

Unisoft ProntoSELECTIVE-SOLDERING software

Unisoft ProntoSELECTIVE-SOLDERING software

New Equipment | Software

ProntoSELECTIVE-SOLDERING is used by electronic manufacturers to quickly program their Selective Soldering machines.   ProntoSELECTIVE-SOLDERING helps program most popular Selective Soldering machines such as ACE Production Technologies, RPS Autom

UNISOFT Corporation

ETA M3 Multi-Function LED Chip Shooter

ETA M3 Multi-Function LED Chip Shooter

New Equipment | Pick & Place

The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel

I.C.T ( Dongguan ICT Technology Co., Ltd. )

BGA Rework Machine for soldering and desoldering.  Hot Air BGA rework station for printed circuit board repair.

BGA Rework Machine for soldering and desoldering. Hot Air BGA rework station for printed circuit board repair.

New Equipment | Rework & Repair Equipment

BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla

Precision PCB Services, Inc

DV-7000 Heli-Flow Pump

DV-7000 Heli-Flow Pump

New Equipment | Dispensing

The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,

ASYMTEK Products | Nordson Electronics Solutions

DV-8000C Heli-Flow Pump

DV-8000C Heli-Flow Pump

New Equipment | Dispensing

The DV-8000C series Heli-Flow® pumps are the newest generation of encoded auger pumps. The pump has a fixed-head design for luer needle applications. The DV-8000 pump's rigid head and fluid path can withstand high pressures generated by thick fluids

ASYMTEK Products | Nordson Electronics Solutions

BGA Rework Station, Split Vision, High Resolution, Model SV560

BGA Rework Station, Split Vision, High Resolution, Model SV560

New Equipment | Rework & Repair Equipment

The model SV560 is has a high resolution optical system for placement of components as small as 1mm.  With it's rapid heat infrared area heater it can rework boards as large a 36" and 36 layers. High Resolution HDMI Vision System Fits Boards up t

Precision PCB Services, Inc

BGA Rework Station, Nitrogen Capable, Model E6250U

BGA Rework Station, Nitrogen Capable, Model E6250U

New Equipment | Rework & Repair Equipment

NEW!  Nitrogen Capable for High Yield Lead Free BGA Rework. NEW! Movable top and bottom gas heaters allows for easy rework near the edge and hard to ger area's of large PCB's. For high volume BGA Rework on even the largest computer and networking b

Precision PCB Services, Inc

Nitrogen Capable SMD & BGA Rework Station Model E6250U with Cabinet

Nitrogen Capable SMD & BGA Rework Station Model E6250U with Cabinet

New Equipment | Rework & Repair Equipment

NEW!  Nitrogen Capable for High Yield Lead Free BGA Rework NEW! Movable top and bottom gas heaters. NEW!  All Shuttle Star BGA Rework Stations are now available with Cabinet Base on wheels. For high volume BGA Rework on even the largest computer a

Precision PCB Services, Inc

APR Solder Paste Dipping Plate

APR Solder Paste Dipping Plate

New Equipment | Solder Paste Stencils

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t

BEST Inc.

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