Powerful 3D AOI solution for accurate inspection results. The S3088 ultra blue addresses the growing demand for reliable and easy-to-use 3D AOI technology at an economical price. Viscom’s powerful approach is a combination of high quality, cost-effe
We provide Bga rework station and X-ray inspection machine for SMT. For more information , please contact Rita Li by: whatsapp:0086 134 3448 1030 Skype:ritaleeli Seamark Zhuomao Fine pitch LED repairing equipment ZM-R720 for beads soldering and
S3088 ultra with high-performance sensor technology XM 3D - the new standard in assembly inspection. High-speed solder joint inspection. Highest inspection depth. Simple operation. In today's electronics manufacturing environment, reliable and econ
SMT stencils for standard and ultra-fine pitch applications
Up to 3500 pph with fine pitch capabilities starter package includes: 12 tape feeders ,fine pitch squaring station, teach camera and Pentium computer for $19,975.00
Up to 4500 pph with fine pitch capabilities starter package includes: 12 tape feeders ,fine pitch squaring station, teach camera and Pentium computer for $29,975.00
New Equipment | Solder Paste Stencils
We use fine grain stainless steel for the base of all our Stencils, All Stencils are cut on LPKF lasers which ensures the best quality for optimum paste release. Our Stencils are offered in thicknesses from .0015" to .0020". Our laser cut Stencils c
placement machines range from the full-featured, entry level priced, 96 feeder MY9 to the high mix, high volume, 240 feeder MY19. Mydata is famous for flexibility, high mix, ease-of-use, and fast programming yet can place up to 21,000 CPH with the 8
A highly refined and capable Ultra-Fine Pitch printer suited for all types of Fine Pitch SMT production. PrinTEK I MP-1818 embodies Transition Automation’s 20+ years of expertise in Fine Pitch SMT printing and squeegee design to give users an unpara
The Sniper SMD-7007 combines the reflow operation of the Flo-master with the latest technology in optic and alignment design. It provides absolute control in positioning all ultra fine pitch QFP, CSP, BGA, uBGA, Large Ceramic or plastic BGA devices
