New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
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Automatic SMT Splicing Machine BMM08G/G_Plus Functional advantages ▶Simple operation: 5 minutes to learn to operate, everyone can operate, reducing dependence on personnel. ▶Foolproof and error-proof: Automatically scan the code to compare and prev
New Equipment | Fabrication Services
Flexible PCB includes single sided FPC, double sided FPC and multilayer FPC, etc. Single FPC has chemically etched conductive pattern layer, the conductive pattern layer on the surface of the flexible insulating substrate is calendered copper foil. T
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
New Equipment | Rework & Repair Equipment
Protecting Heat Sensitive Components. Are you in need of a flexible method for shielding nearby components during the PCB rework process? Do you find yourself looking for an effective heat shielding product which can be easily modified to protect a
Polyimide tape can either be amber or clear in color, and the film thickness ranges 1 and 3 mils while the adhesive may range from 1 to 2 mils thick. It may be double sided, and the adhesive may be silicone or acrylic based. Anti-static Polyimide t
Polyimide -Feb tape BJ-CF polyimide film is the general Polyimide film that is coated or laminated on one or both sides with Teflon? FEP fluoropolymer. It imparts heat sealability, provides a moisture barrier, and enhances chemical resistance. App
Tape KD851/852 is a polyimide film-backed silicone adhesive tape with high temperature resistant. Application Mask for printed circuit boards during wave solder or solder dip process. Features：KD851 Total Tape T
The heat resistance and dielectric strength of polyimide tapes make them an excellent choice for high temperature masking and electrical insulation. CGS has different thickness polyimide coated with silicone. CGS can offer different width such as
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