The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
New Equipment | Education/Training
We have created interactive CD ROM, inspection posters and photo library CD ROMs covering design, assembly, soldering, rework and inspection
Three solutions for virtually any application. BGA Socket Adapter Systems featuring eutectic solder balls and footprints which match BGA device are designed for high volume production applications. Pop-Top� Socket Adapter Systems features integral he
KE-3020V represents the latest leading-edge technology for improved flexibility and production quality. Higher Speed, Higher Quality, Improved Capacity. The KE302V is a 7th generation modular placement machine from Juki and represents the latest lea
Our Tacky Flux includes No-Clean and Water-Solube types, only for dispensing ( named of Soldering Flux) in Back-End Ball-Attach process, and SMT & BGA repair or rework, PoP, Stud Bumping (Golden Bumping) etc, Key benefit : 1) regular flux shot and
Nordson Dage XD7600NT500 X-Ray Inspection System with X-Plane Analysis - Datest was one of the first users of the X-Plane algorithm. We now have 3 years of experience using X-Plane. It is a very powerful tool for detecting head-in-pillow (HiP) de
New Equipment | Education/Training
Our web based seminars represent an efficient way for you and your team to develop practical knowledge, delivering expert advice and guidance to you where, when and how you choose. Simple webinars offer a low cost and time efficient training option.
Model A4900 Flash MP3 Player Features: �� Compatible with MP3, WMA, WAV, WMV(sound only) & ASF(sound only) �� USB Flash disk functions,Windows ME/2000/XP no need to install driver �� 7EQ: Natural,Jazz,Pop,Rock,Classic,DBB,Soft ---LCD with Backli
New Equipment | Solder Materials
Solder Balls... Solder Spheres... Whatever you may call it, we think it is the perfect soldering package. We consider it the ultimate solder preform for solder attach, rework / reballing of PIP, POP, PBGA, or Flip Chip… The relative low cost and indu
Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package
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