New Equipment | Fabrication Services
Base Material: FR4 Layer count: 4 layer Board thickness: 1.6mm Copper Thickness:1 oz Surface finish: nickel gold plating Soldermask Colors: Green Size:159.25*182/1up
PCB Prototype - 2 Layer, Hard Gold Plating 30u", Controlled Deep Cut/Milling And Special CNC - 2 layer, hard gold plating 30u", controlled deep cut/milling and special CNC. - Red solder mask.
REPAIR & REWORK OF GOLD CONTACTS, E.G. GOLD FINGER,CONNECTORS, SOLDER ON GOLD PROBLEM, COSTUME JEWELLERY, DENTAL, OPTICAL, ETC.
Rogers Material 1.6mm Thickness 2 Layers 1oz copper thickness Gold Plating Surface Treatment red Solder Mask e-test
New Equipment | Assembly Services
PCB Prototype - 2 Layer, Metal Core Board, Hard Gold Plating 30u", With Black Solder Mask - 2 layer, metal core board, hard gold plating 30u", with black solder mask. Advantages: - Metal core board. A PC board to be populated with electronic compo
Porous ceramic vacuum chuck table or Polishing Chuck table supplied to semiconductor industry for silicon wafer dicing or finishing purposes. This product is an uniform compact frame, high strength, good porosity, durable absorption, excellent quali
Gold finger PCB/Impedance computer circuit board Layer:6 Thiness: 2.0mm Surface treatment: ENIG+Hard gold plated on gold finger Impdance control: Single-ended 50ohm, differential 90 ohm Application: Computer
Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
Reel-to-reel plating; Wire bondable Gold, Silver, Copper, Nickel,...
New Equipment | Design Services
Layer：4 Material：FR-4 4/4/4/4oz Thickness：2.0 Minimum hole：0.35mm Minimum Tracc/Spacing：12mil/15mil Application：power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space:
