New Equipment | Wave Soldering
V-soltes WS series armed with hot air preheating, nitorgen packaging, dual wave soldering pot and external high power cooling system is proved to be the exact solution to its high process requirement for SMT/AI. - Flux capacity：6L； - Flux runoff：10-
Lead Free 4 Top 4 Bottom plus 1 cooling zone Vintage: 2003 Specs: Substrate size(min/max): L100xW25mm/ L250xW75mm Substrate Height : 10mm max (upper) Transfer method : wire belt conveyor method Transfer height : 900 A+/- 20
New Equipment | Industrial Automation
Yokogawa DCS CS1000 CS3000 ： AAI141 AAV141 AAV142 AAI841 AAB841 AAV542 AAI143 AAI543 AAV144 AAV544 AAT141 AAR181 AAI135 AAI835 AAT145 AAR145 AAP135 AAP149 AAP849 ADV151 ADV551 ADV141 ADV142 ADV157 ADV557 ADV161 ADV561 ADR541 CENTUM：ADV85
Yamaha Motor Co., Ltd. has developed the new YSP20 D×D Printer, a solder-paste (cream solder) printer that adopts dual-stage, dual-stencil printing to achieve an extremely fast printing speed and a variety of new and unique functions at the same time
New Equipment | Industrial Automation
TDC3000 SYSTERM CARDS 51304516-200,51305348-100,51304584-100,51401583-100, 51304362-150,51309152-100,51304485-100,51304441-100, 51402615-400,51401583-100,51196654-100,51402089-100, 51304685-150,51304511-100,51304511-200,51304754-150, 51304337-15
| 1 |
.gif)
