New SMT Equipment: pre bake bga (Page 1 of 2)

Quantum™ Q-6800 In-Line, Large-Format Fluid Dispensers

Quantum™ Q-6800 In-Line, Large-Format Fluid Dispensers

New Equipment | Dispensing

ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa

ASYMTEK Products | Nordson Electronics Solutions

BGA Reballing

BGA Reballing

New Equipment |  

Salvage indispensible Ball Grid Arrays. Artek Manufacturing will: *Clean and Bake out all contaminants and moisture *Clean out all exsisting Solder *Replace solder spheres according to manufacture's specs *Bake out BGA prior to packing in MSD package

Artek Manufacturing Inc

TempTell Reflower

TempTell Reflower

New Equipment |  

Reflow cycle - runs the oven through the pre-defined temperature profile.> Bake cycle - used to drive the moisture from moisture-sensitive components.>

Articulation LLC

SEMIPACK

SEMIPACK

New Equipment |  

SemiPack provides a complete outsourced solution for the preparation and packaging of electronic components, servicing original equipment manufacturers, electronics manufacturing services (EMS) providers, contract assemblers and distributors. SemiPac

PFI of Florida Inc.

Scotle IR360 Pro 2 in 1 Infrared BGA Rework Station

Scotle IR360 Pro 2 in 1 Infrared BGA Rework Station

New Equipment | Rework & Repair Equipment

Scotle IR360 PRO is a 2 in 1 BGA rework station which can be used as infrared BGA rework station and hot air BGA Rework station with three independently temperature zones. Users can use total different BGA rework system only in one BGA rework station

Scotle Technology Group Limited

Assembly Services

Assembly Services

New Equipment |  

SST offers a full range of electronic manufacturing services to its customers. With the ability to offer both turn-key and consignment manufacturing for nearly any size project, we stand ready to become your manufacturing partner. SST offers a wide r

Senior Systems Technology

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material

New Equipment | Materials

500⁰C) Compatible with multiple lamination cycles Standard PCB lamination cycles may be used Excellent for Laser Via formation Excellent CAF resistance Uses standard desmear and plating processes High Modulus: 1100 kpsi Lo

Integral Technology, Inc

Martin MiniOven-05 - Desktop Reflow Oven

Martin MiniOven-05 - Desktop Reflow Oven

New Equipment | Rework & Repair Equipment

Desktop Reflow Oven For Reballing and Prebumping of SMD Components The new MiniOven-04 is perfectly suitable for a wide range of applications, from small QFNs to very large BGAs. This is due to our extensive selection of stencils and masks for almos

MARTIN (a Finetech company)

Scotle-HR360 BGA Rework Station

Scotle-HR360 BGA Rework Station

New Equipment | Rework & Repair Equipment

Scotle-HR360 BGA Rework Station Products Description Scotle-HR360 BGA rework station is with 7.2 inch touch screen. Scotle-HR360 applies ARM32 bit microprocessor. Scotle-HR360 can generate profile automatically during reworking process. Scotle

Mobile BGA Rework Station

X-1 Precision SMT/BGA Rework Station

X-1 Precision SMT/BGA Rework Station

New Equipment | Rework & Repair Equipment

The X-1 Precision SMT/BGA Rework Station is a flexible system designed for manual alignment and placement or removal of BGA, microBGA, Flip Chip, CSP and other surface mount electronic components with precisely controlled solder reflow profiles. The

Precision Manufacturing Tools Div. of Prodev, Inc.

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