Preforms are used for specialty component attach and die / substrate attach for device makers.
New Equipment | Solder Materials
We manufacture both solder preforms and pad repair kits. Our geometries are available starting at 25um and up in SnAg, SnPb, Cu and Au, Ag and other finishes.
Wide variety of styles including Peel-A-Way� low profile removable carrier, high density molded connectors, and more. Patented features such as solder preforms and screw-machined terminals offer high reliability.
Stencils, metal mask tools used for the deposit of solder paste or preformed solder balls onto BGA substrate. Please call for the best process for your requirements.
Specialty Solder Products for SMT Assembly- Solder Paste (No-Clean, Water Wash), Solder Spheres, Fluxes, Preforms, Wire, Ribbon.
New Equipment | Solder Materials
Indium Corporation is a developer, manufacturer, and global supplier of: specialty solders (including solder paste, preforms, spheres, columns, wire, tubing, ribbon, and foil), fluxes, electrically-conductive adhesives, inorganic compounds (including
AIM is a leading global manufacturer of solder assembly materials for the electronics industry. Our product line includes solder paste, liquid flux, bar, wire, preforms, adhesives, cleaners, chemicals, plating anodes and indium and gold alloys. We al
New Equipment | Solder Materials
AMTECH’s BGA solder spheres are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. AMTECH BGA solder spheres also exceed both the IPC and MIL standards for purity levels and size tolerances. N
New Equipment | Solder Materials
Solder Balls... Solder Spheres... Whatever you may call it, we think it is the perfect soldering package. We consider it the ultimate solder preform for solder attach, rework / reballing of PIP, POP, PBGA, or Flip Chip… The relative low cost and indu
TM230 solderable conductive adhesives are rapid cure, self-filling, self-leveling and self-soldering adhesives which can be used as die attach adhesives for LED, CSP, QFP, among others, to replace conductive adhesives (Ag) or solder materials such as
