Orion has high-speed die cutting presses ranging from 1 to 60 tons. We also have stamping presses that range from 1 to 60 tons. Our other Die cutting capabilities include: Production parts up to 60" x 30" Kiss cut parts up to 24" x 30"
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Press Fit Technology is the process of choice for many electrical engineering applications. Press Fit technology creates mechanically and electrically stable gaslight connections without the need for additional fastenings, soldering or thermal stres
Design, manufacture and implementation of PCB assembly tooling. Unique designs of SMT pallets, solutions, screenprint, wave solder, press fit, metal work assembly, box build, test.
Design, manufacture and implementation of PCB assembly tooling. Unique designs of SMT pallets, solutions, screenprint, wave solder, press fit, metal work assembly, box build, test.
Altronics has a flexible process that can cost effectively handle low volume high-mix, through mid volume production manufacturing. PROTOTYPES: We will work closely with you to quickly turn around your PCB printed circuit board prototype assemblies
dataCon has designed and manufactured many of the current backplane technologies such as VME 64X, PCI, and VXI. We can provide substrate procurement (from one of our partner companies or the customer's approved supply base), press fit and solder asse
Stainless Steel "Wader" enclosure for PCB containment during aqueous wash. Integrated Hinge System Press fit closure clasps No welds to crack Standard Sizes: Part number 14141: 14 in x 14 in x 1.5 in high w/closure clasp Part number 16202: 16 i
New Equipment | Assembly Services
US based Electro-Mechanical Assembly Services Many companies in today's competitive marketplace have determined that assembly work is not within their core competency, and wish to find a manufacturing partner. In addition to what we assemble in hou
New Equipment | Assembly Services
Perfectly Controlled Immersion Tin System The Horizon Stannatech system is the leading immersion tin system within the entire PCB industry. Together with the Stannatech process and Atotech's unique Crystallizer and ConStannic control systems for im
9 SMT Assembly Lines Total placement capability 150,000 components/hr Fine pitch placement up to 12mil Component Ranges: 0201 to BGA and uBGA up to 55mm square 40 microns placement accuracy with 4 sigma capability RoHS Compliant Lines with N2 envi