The PrinTEK I Model APS gives you exceptional fine pitch accuracy along with an open design for easy stencil loading and alignment. A precision R-Theta tooling plate is manually loaded and unloaded during the print cycle, and the squeegee stroke and
Lean, high speed, screen printing. Adaptable to dual lane for faster production, the Panasonic SPG can also handle large boards. A great companion for the AM100 Placement Machine Panasonic's SPG high-speed screen printing machine is the ultimate
3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys
Although emulsion screens are one of the oldest forms of printing, they remain the most versatile to this day. Emulsion screens are made from a frame. Mesh is stretched onto this frame, and the mesh is then imaged ready for printing. There are many
The LaserVision Mini SP3D system combines laser measurement accuracy with Automatic Data Collection (ADC) for real-time control of the SMT stencil printing process. With its Windows® 7+ Pro OS and service free USB interface, the Mini SP3D system is e
Machine and Process Capability tests are used to verify intended performance. A Machine Capability Analysis (MCA)test evaluates a desired machine's accuracy and repeatability under it's own load, specifically the vision alignment system. MCA studies
CeTaQ Americas, LLC (formerly EAGLE-EYED ONE Sales & Service)
New Equipment | Solder Paste Stencils
Stentech has the technical ability to manufacture step stencils in both single process and dual process. Today's complex PCBs with the various components require different solder paste volumes. Stentech has the technical expertise to optimize the ste
New Equipment | Solder Paste Stencils
Lasercut LTCC-stencil (Low Temperature Cofired Ceramic) The LTCC-technology (low temperature co-fired ceramic) is used in the hybrid-technique when several interconnection levels are realized. The connections between the layers are manufactured with
Model: EP-1 1510, EP- 2010 and EP-2515 EP-1 series profile projector is one kind of high precision measuring instrument, which is unified with optic, precision machinery and electronic measurement, mainly used for measuring and inspecting the size,
New Equipment | Solder Paste Stencils
Laser cut stainless steel stencil for solder paste printing on wafer. Wafer bumping stencils are characterized by a high number of apertures which lie close together in the size of 90µm x 110µm. A package density of up to 250000 openings is not unus
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