Metal blades have grown in popularity, particularly with the increased use of a mix of larger and fine pitch components on the same board. Low-cost stainless steel blades provide a viable alternative, since they operate with a larger pressure window
Extremely reliable, proven inspection for wave, reflow, pre-reflow and selective soldering. The S3088 flex AOI system was developed for reliable, economical defect detection and fast process optimization. From prototypes to large volume, this flexib
Optimal Accuracy and High Placement Rate with ultra fine-pitch placers that delivers optimal accuracy for components ranging from 0201 chips to large connectors and odd form SMDs. Main Features and benefits: Total Component Range The Emerald-XII
New Equipment | Cleaning Equipment
Hyproclean Stencil Cleaning rolls - Proven Superior Cleaning Performance especially in ultra fine pitch situations. Benefits: Hyproclean stencil rolls give a high performance cleaning without having to use toxic chemicals in manufacturing the fabri
New Equipment | Soldering - Other
Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. Printing scraper can rotate 45 degrees fixed up, easy printing stencil and squeegee cleaning and replacement. Block can be adjusted bef
Manual Solder Paste applier frameless stencil printer FP2636 Product Description FP2636 is a high precision manual stencil solder printer for PCB board. It is small and easy to operate,affordable,which is suitable for prototype and small scale
New Equipment | Coating Materials
Technic Releases TechniFlex LCL1000F/423M New Flexible Black Soldermask for Direct Imaging Cranston, RI, USA - Technic has announced the release of TechniFlex LCL1000F/423M, an extremely durable, direct imaging, fine pitch, matte black solder mask
3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys
The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate
Advanced semiconductor packaging and high precision SMT assembly convergence. Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced techno
