Automatic solder paste printer machine for 1200mm PCB Description: LK-F1200 Ideal for LED production which for Accuracy it has built-in ±10 micron alignment,and ±25 micron wet print repeatability (≧2.0Cpk@6sigma) with 20 seconds total throughpu
As population of circuit boards become more dense and with continual component size reductions, printing precision has become more challenging. Not only are improvements necessary to the manufacturing equipment & process, but also its raw material se
New Equipment | Soldering - Other
Specifications: FPC Soldering Machine YSPP-1A 1. Accurate Tin press,not drag. 2. Accurate heat. 3. Fine-pitch position. 4. Digital program pressure control. Features: FPC to PCB Board Pulse-Heated Soldering Machine/Welding Machine 1.Extremel
Ascentron is an ISO9002 electronics manufacturing services provider specializing in customer service, engineering manufacturing, and assembly technology in southern Oregon. Our modern surface mount technology enables us to place BGA, fine pitch, odd
Ascentron is an ISO9002 electronics manufacturing services provider specializing in customer service, engineering manufacturing, and assembly technology in southern Oregon. Our modern surface mount technology enables us to place BGA, fine pitch, odd
JRE, Inc. is a provider of Contract Electronic Assembly Manufacturing Services. Quick turn as well as volume production capabilities for SMT, Fine Pitch placements, BGA and micro BGA, Thru- hole, Hybrid, RF, complete turn-key and box builds. Servic
Our manufacturing capabilities allow us to support all aspects of the electronics manufacturing process. Our production processes include: High speed continuous flow SMT lines. High Mix SMT and PTH. Automated PTH assembly. Fine Pitch, BGA, CSP, C
440-R SMT Detergent is the most widely used aqueous-based chemistry for cleaning SMT screens, stencils, misprinted PCBs, pallets, oven radiators and related tooling. It is the only cleaning chemistry to be verified by the U.S. Environmental Protecti
Surface Mount, Through Hole, or Mixed Technology on Single or Double Sided PWB assemblies BGA, CSP, components to 0402, Fine Pitch to 12 mils, 100% passive testing prior to placement. In-circuit programming, full functional testing and automated opt
New Equipment | Assembly Services
10-Layer Via-in-Pad Technology PCB features blind via in L9-10 in addition to the Fine Pitch BGA. Putting the via in the pad creates space on the external layers for more routing and avoids potential shorts during assembly. The routing channel widt
