process[0] - SMT Electronics Manufacturing

New SMT Equipment: process[0] (Page 1 of 1)

8 layers PCB with BGA and golden fingers

Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.20MM Minimum drilled hole diameter: 8mils Copper thickness: 0.5oz Special process : 0.40MM BGA , golden fingers

CYZON LIMITED

8 layers PCB with blind buried vias

New Equipment | Fabrication Services

Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 4mils Copper thickness: 0.5oz Special process : 0.25MM BGA , resin plugged vias in BGA pads

CYZON LIMITED

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New SMT Equipment: process[0] (Page 1 of 1)

8 layers PCB with BGA and golden fingers

8 layers PCB with blind buried vias

process[0] searches for Companies, Equipment, Machines, Suppliers & Information