Heller 1707 MK7 SMT Reflow Oven 7 Heating ZonesMax PCB Width: 56cmWeight: 1450KGDimension: 360x152x144cmProduct description: Heller 1707 MK7 SMT Reflow Oven, 7 Heating Zones, Max PCB Width: 56cm, Weight: 1450KG, Dimension: 360x152x144cm Heller
New Equipment | Rework & Repair Equipment
The Zhuomao ZM-R7850A BGA Rework Station is a top of the line Nitrogen Capable Rework System. Great to help increase yield with Lead Free Solders and a no clean process. Place SMD components from .8mm to 80mm with the high resolution motorized vis
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
Middle Size Lead Free SMT Reflow Oven for LED A600 Model: A600 MID-sized Lead-free Reflow Oven(6-zone) Brief: Lead-free reflow soldering Heating System > Eight groups of top and bottom forced hot air convection heating zones. > Patented heati
Profile Thermocouples for both horizontal and vertical diffusion furnaces, LPCVD, CMOS, ... Spike heaters based on Thermocouples
Profiling is essentially a means to an end. What is important is to set up the oven quickly, and to make sure that each and every product is processed in spec. The KIC Profiling Kit joins the other KIC offerings designed to help electronics manufactu
Accurately senses component temperatures without soldering or taping! TEMPROBE™ is a patented, precision temperature sensing instrument. The subminiature thermocouple tip can be placed anywhere on a board, including profiling in wet solder paste or
Classic PCB Profiling tools are used to create a repeatable thermal process that meets the specifications required by the solder paste and or component manufacturers. Only by profiling do you have any idea of what the actual temperatures are on the c
The SolderStar PRO thermal profiling systems include our latest evolution of ultra-compact datalogger featuring the unique SolderStar ‘SmartLink’ connector system. The thermal profiler unit is docked into a protective heat shield and thermocouple ada
The 907 micro Placer series allows you to place and rework BGA, mBGA, QFP, and Flip-Chip devices quickly and accurately. This unit is quick and accurate for placing devices with the added option of built in rework. You can place and reflow devices w
