New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
New Equipment | Assembly Services
Rapid Coatings offers both manual and automated coponent underfill services using a variety of encapsulants to help protect customer's sensitive compnents on their assemblies.
New Equipment | Assembly Services
Rapid Coatings offers both manual and automated coponent underfill services using a variety of encapsulants to help protect customer's sensitive compnents on their assemblies.
Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package
World's First Super Fast Low Temperature Underfill. SMT88U is an adhesive, which combines the advantages of fast cure in UV adhesives, and the better reliability of capillary underfill. It can be underfilled at room temperature without preheating a
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
YINCAE’s Fully Flux Residue Compatible Underfill: UF 158HA (Albany, NY) August 15, 2022 YINCAE is excited to announce that we have developed UF 158HA that is fully compatible with flux residue and high performance underfill.
SMT 158UL is a super-fast flow capillary underfill, which can flow into 10μm gap at room temperature without preheating a substrate. After cure there is void free in underfill. The cured SMT 158UL can be easily reworked. SMT 158UL not only can be use
SMT 88UL is a super-fast flow capillary underfill, which can flow into 10μ gap at room temperature without preheating a substrate. After cure, there is void free in underfill. The cured SMT 88UL can be easily reworked. SMT 88UL not only can be used a
-세계 최고 품질의 대류열풍방식으로 새로운 표준을 선도하는 HELLER Reflow Oven -10년 연속 World Wide Market Share 1위와 2014 SERVICE EXCELLENCE AWARDS 수상
459-1 Jangji-Dong, Kwangju-Si
Kyungki-Do, 13 South Korea
Phone: +82-31-769-0808
