New SMT Equipment: pth fill (Page 1 of 1)

IPC J-STD-001F Standard

IPC J-STD-001F Standard

New Equipment | Education/Training

IPC J-STD 001 REV F Requirements for Soldered Electrical and Electronic Assemblies.  The IPC J-STD-001F standard is the industry-consensus document with respect to the assembly of PCBs and electronic assemblies. Released August 2014. IPC J-STD-001

BEST Inc.

X3 Inline X-Ray Inspection System / 3D & Transmission

X3 Inline X-Ray Inspection System / 3D & Transmission

New Equipment | Inspection

Inline x-ray inspection system for combined 3D and transmission x-ray analysis of double-sided boards with high package density. Universal standard system based on the MatriX X2.5 AXI system motion concept with 360º angle shot coverage. A new 3D reco

MatriX Technologies GmbH

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