New SMT Equipment: qfn solder balls (Page 2 of 10)

FINEPLACER® core<sup>plus</sup> - Medium Size BGA Rework Station

FINEPLACER® coreplus - Medium Size BGA Rework Station

New Equipment | Rework & Repair Equipment

Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price.  The system offers proven rework technology for a wide spectrum

Finetech

Low Melting Type BGA Solder Ball

New Equipment |  

Sn-Zn-Al, Sn-Zn-3Bi, Features; Luster/Strong Joint, Melting Temp. 199C, �80-760�m

CCT Europe BV

High Temperature Type BGA Solder Ball

New Equipment |  

Sn-Ag-Cu, Sn-Cu, Features; for High Temp Application, Melting Temp. 220-227C, �80-760�m

CCT Europe BV

eBall Lead-Free Solder Spheres

eBall Lead-Free Solder Spheres

New Equipment | Solder Materials

High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch

Nihon Superior Co., Ltd.

SPA 1000 Solder Paste Analyzer

SPA 1000 Solder Paste Analyzer

New Equipment | Solder Materials

SPA1000 – Solder Paste Analyzer ( slump, tack, wetting, solder ball, spread), all-in-one test.

Ascentech LLC

FINEPLACER® matrix rs Semi-automatic SMT Rework Station

FINEPLACER® matrix rs Semi-automatic SMT Rework Station

New Equipment | Rework & Repair Equipment

Future in Advanced Rework. The FINEPLACER® matrix rs is a semi-automatic rework station representing the latest development from Finetech, encompassing the “Built to be Best” philosophy. With a high level of process modularity, the system supports

Finetech

BGA Rework & Micro BGA Rework Stencils

New Equipment |  

Stencils, metal mask tools used for the deposit of solder paste or preformed solder balls onto BGA substrate. Please call for the best process for your requirements.

I-Source Technical Services, Inc.

BGA ReBalling System

BGA ReBalling System

New Equipment |  

Don't throw your BGA's away, re-ball them with the Waveroom Plus Reballing system. This is a very user friendly system that is being used extensively by Contract Assembly houses. There are other systems, most much more expensive than this. None work

Waveroom Plus

Easy re=place - Bga Rework machines

Easy re=place - Bga Rework machines

New Equipment |  

Ball grid array placement and soldering The Etneo "easy re=place" is a system for the easy placement and soldering of any SMT components. The system has an exclusive and unique solution to easy and quickly determine the correct soldering profile

Etneo Italia spa

Martin MiniOven-05 - Desktop Reflow Oven

Martin MiniOven-05 - Desktop Reflow Oven

New Equipment | Rework & Repair Equipment

Desktop Reflow Oven For Reballing and Prebumping of SMD Components The new MiniOven-04 is perfectly suitable for a wide range of applications, from small QFNs to very large BGAs. This is due to our extensive selection of stencils and masks for almos

MARTIN (a Finetech company)


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