World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
Low Velocity Nitrogen Convection for BGA Solder Ball Attachment and Semiconductor Backend Assembly
We are a Re-balling company based in Chihuahua, Chihuahua.Our core business is the Salvage and Recovery of Electronic Components.Also we offer technical consulting and training in SMT and Wave Soldering.
The perfect solution for a cost-effective yet powerful x-ray inspection system. The TruView™ Prime is a fully motorized radiography system developed to meet the stringent requirements of electronics assembly and component inspection. The TruView Pri
Salvage indispensible Ball Grid Arrays. Artek Manufacturing will: *Clean and Bake out all contaminants and moisture *Clean out all exsisting Solder *Replace solder spheres according to manufacture's specs *Bake out BGA prior to packing in MSD package
New Equipment | Assembly Services
Benefit from our versatility and experience. We manufacture rigid printed circuit boards, rigid-flex and flexible printed circuit boards [including crimp technology]. You`ll find us flexible as far as dimensions are concerned: in addition to standard
New Equipment | Solder Materials
Solder Balls... Solder Spheres... Whatever you may call it, we think it is the perfect soldering package. We consider it the ultimate solder preform for solder attach, rework / reballing of PIP, POP, PBGA, or Flip Chip… The relative low cost and indu
- Flexible uses for all different kinds of Components like SMD, BGA, CBGA, CCGA, CSP, QFN, MLF, PGA and All Epoxy undefiled BGA .. etc . - Recommended for reworking All Plastic parts, PTH, Sockets, Connectors and Metal Shields . - Complete reworking
New Equipment | Soldering Robots
Highly Flexible In Insertion Angles. Vertical inline soldering robot, UNIX-700FV is an ideal for irregularly shaped works into which is hard to insert the tip. The vertical multi-joint is utilized to freely change the head angle and quick operation.
Three solutions for virtually any application. BGA Socket Adapter Systems featuring eutectic solder balls and footprints which match BGA device are designed for high volume production applications. Pop-Top� Socket Adapter Systems features integral he
.gif)
.png)
